There were rumors that Apple would use new resin-coated copper (RCC) components in iPhone models to reduce their size and thickness. The revolutionary design change was supposed to roll out to the iPhone 16 family this year, but has since been carried over to the iPhone 17, which is expected to officially launch in 2025. And now prominent Apple analyst Ming-Chi Kuo has suggested that Apple has delayed again. We plan to integrate RCC components into future iPhone models. Rumor has it that concerns about durability and vulnerability are behind Apple’s decision.
The switch to RCC material is imminent
In a post on X (formerly Twitter), analyst Ming-Chi Kuo notes that Apple has once again postponed its plans to use RCC components in future iPhone models. “The new iPhone 17 in 2025 will not use RCC as PCB motherboard material because it cannot meet Apple’s high quality requirements,” Ku wrote on X.
Using RCC components to replace current copper laminates (CCL) will help the Cupertino-based company reduce the size and thickness of the motherboard. This frees up space and could allow future iPhone models to have larger batteries. Concerns about durability and vulnerability could be reasons for the slow adoption of RCC technology.
There were originally rumors that Apple would upgrade the PCB materials in the iPhone 16 series in 2024, but reports have since moved to the iPhone 17 series. Kuo did not say whether the RCC component will be introduced in the iPhone 18 in 2026 or in the iPhone 19 in 2027. However, Apple has yet to reveal any details about its move to RCC materials, so it’s best to take these latest claims with a grain of salt.
The iPhone 17 series: What we know so far
Apple’s 2025 iPhone family is expected to include four models: iPhone 17, iPhone 17 Slim, iPhone 17 Pro and iPhone 17 Pro Max. The Slim model is expected to replace the Plus version and offer a slimmer design. The iPhone 17 family is expected to bring a fresh design, a front camera upgrade, and a smaller dynamic island. The iPhone 17 Pro model is said to use Apple’s A19 Pro chip, while the regular iPhone 17 and iPhone 17 Slim could run on A18 or A19 chips.
Bhupendra Singh Chundawat is a seasoned technology journalist with over 22 years of experience in the media industry. He specializes in covering the global technology landscape, with a deep focus on manufacturing trends and the geopolitical impact on tech companies. Currently serving as the Editor at Udaipur Kiran, his insights are shaped by decades of hands-on reporting and editorial leadership in the fast-evolving world of technology.
