Dilip Buildcon gains on emerging as L-1 bidder for Rs 901.43 crore project

Mumbai, November 11 (Udaipur Kiran): Dilip Buildcon is currently trading at Rs. 404.60, up by 2.95 points or 0.73% from its previous closing of Rs. 401.65 on the BSE.
The scrip opened at Rs. 401.90 and has touched a high and low of Rs. 413.30 and Rs. 400.60 respectively. So far 7442 shares were traded on the counter.
The BSE group ‘A’ stock of face value Rs. 10 has touched a 52 week high of Rs. 496.15 on 11-May-2026 and a 52 week low of Rs. 354.00 on 23-Oct-2026.
Last one week high and low of the scrip stood at Rs. 413.30 and Rs. 377.75 respectively. The current market cap of the company is Rs. 6544.90 crore.
The promoters holding in the company stood at 63.14%, while Institutions and Non-Institutions held 6.81% and 30.05% respectively.
Dilip Buildcon has been declared as L-1 bidder for the tender floated by the National Buildings Construction Corporation (NBCC (India)) on Engineering, Procurement and Construction (EPC) in the state of Jammu & Kashmir.
The project involves the development of Satellite Township Phase-l, Package- 3 (Group Housing 02) including allied works at Rakh Gund Aksha, Bemina, Srinagar (J&K) on Design, Engineering, Procurement and Construction (EPC) basis with Operation & Maintenance of 2 years).
The project, valued at Rs 901.43 crore (including GST), will be completed within 24 months, followed by two years of Operation & Maintenance (O&M).
Dilip Buildcon’s core business is undertaking construction projects across India in the roads and irrigation sectors. They specialize in constructing state and national highways, city roads, culverts and bridges.
Bhupendra Singh Chundawat is a seasoned technology journalist with over 22 years of experience in the media industry. He specializes in covering the global technology landscape, with a deep focus on manufacturing trends and the geopolitical impact on tech companies. Currently serving as the Editor at Udaipur Kiran, his insights are shaped by decades of hands-on reporting and editorial leadership in the fast-evolving world of technology.

